W25Q16DW
7.2.30
Read Manufacturer / Device ID (90h)
The Read Manufacturer/Device ID instruction is an alternative to the Release from Power-down / Device
ID instruction that provides both the JEDEC assigned manufacturer ID and the specific device ID.
The Read Manufacturer/Device ID instruction is very similar to the Release from Power-down / Device ID
instruction. The instruction is initiated by driving the /CS pin low and shifting the instruction code “90h”
followed by a 24-bit address (A23-A0) of 000000h. After which, the Manufacturer ID for Winbond (EFh)
and the Device ID are shifted out on the falling edge of CLK with most significant bit (MSB) first as shown
in Figure 29. The Device ID values for the W25Q16DW is listed in Manufacturer and Device Identification
table. The instruction is completed by driving /CS high.
/CS
Mode 3
0
1
2
3
4
5
6
7
8
9
10
28
29
30
31
CLK
Mode 0
Instruction (90h)
Address (000000h)
DI
(IO 0 )
DO
High Impedance
23
*
22
21
3
2
1
0
(IO 1 )
* = MSB
/CS
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
Mode 3
CLK
DI
(IO 0 )
0
Mode 0
DO
(IO 1 )
Manufacturer ID (EFh)
7
*
6
5
4 3
Device ID
2
1
0
Figure 29. Read Manufacturer / Device ID Instruction (SPI Mode)
- 56 -
相关PDF资料
W25Q16VSFIG IC FLASH 16MBIT 80MHZ 16SOIC
W25Q32BVZPIG IC SPI FLASH 32MBIT 8WSON
W25Q32DWZEIG IC FLASH SPI 32MBIT 8WSON
W25Q40BWSSIG IC FLASH SPI 4MBIT 8SOIC
W25Q40BWZPIG IC FLASH SPI 4MBIT 8WSON
W25Q64BVSFIG IC SPI FLASH 64MBIT 16SOIC
W25Q64CVZEIG IC SPI FLASH 64MBIT 8WSON
W25Q64DWZEIG IC FLASH SPI 64MBIT 8WSON
相关代理商/技术参数
W25Q16DWSFIP 制造商:WINBOND 制造商全称:Winbond 功能描述:1.8V 16M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
W25Q16DWSNIG 制造商:WINBOND 制造商全称:Winbond 功能描述:1.8V 16M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
W25Q16DWSNIP 制造商:WINBOND 制造商全称:Winbond 功能描述:1.8V 16M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
W25Q16DWSSIG 功能描述:IC FLASH SPI 16MBIT 8SOIC RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:2,500 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:1K (128 x 8) 速度:100kHz 接口:UNI/O?(单线) 电源电压:1.8 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-TSSOP,8-MSOP(0.118",3.00mm 宽) 供应商设备封装:8-MSOP 包装:带卷 (TR)
W25Q16DWSSIP 制造商:WINBOND 制造商全称:Winbond 功能描述:1.8V 16M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
W25Q16DWZPIG 制造商:Winbond Electronics Corp 功能描述:IC FLASH 16MBIT 104MHZ 8WSON
W25Q16DWZPIP 制造商:WINBOND 制造商全称:Winbond 功能描述:1.8V 16M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
W25Q16V 制造商:WINBOND 制造商全称:Winbond 功能描述:16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI